C250 Lead Free Soldering Machine

Features

C250 Wave Solder Key Features

• High Quality Design and Construction To Meet Standards of Japanese Electronics Market
• Small Footprint - Approx. 1250 mm x 760 mm (50" x 30")
• Single- or Dual-Wave Configurations for Through Hole and Surface Mount Assemblies
• Seamless, Cast-Iron (100 kg cap.) Solder Pot with Corrosion Resistant Coating and Three Year Warranty
• Built-In Solder Pot Loading and Maintenance Platform with Locking Support Mechanism
• Heavy Duty Pump Motor with Dial-Adjustable Wave Height Control; Low-Temp and Overheat Alarms
• Choice of Standard Foam-Fluxer or Innovative Drum-Spray Fluxer for Superior Flux Application Consistency and Reduced Operating Cost
• Optical Sensors for On/Off Control of Fluxing and Wave Operations
• Stainless-Steel Sheath Type IR Preheater with PID Temperature Control
• High-Temperature, Corrosion Resistant, Finger-Type Conveyor with Width and Angular Adjustment
• Motorized, Chain-Driven, PinType Inlet Conveyor Mechanism
• Air Knife Cooling (option)
• Standard Panel Control or Optional Touch Panel PLC Controller with Weekly Timer for Startup and Shutdown

More Information

Low-Volume, Seamless Solder Pot Loads Easily and Carries Three-Year Warranty

C250 Wave Soldering Systems feature a high-efficiency, low-volume solder pot and corrosion-resistant wave pumping system. Developed in conjunction with some of our closest customers, the initial start-up cost for solder when using the C250 is approximately two-thirds to half the cost of competitive equipment. Our high-efficiency heaters and small, 100 kg (220 lb.) volume considerably decrease start-up time and consume much less energy, but more importantly reduce oxidation and dross formation. The specially-coated, solid cast-iron solder pot has a seamless construction and includes a three-year replacement warranty. The solder pot and wave assembly easily slide out from the rear of the unit onto an extendable platform and are braced by heavy-duty supporting legs during loading and maintenance

Available in Either Single- or Dual-Wave Configuration

The C250 is supplied as standard in a single-wave configuration for conventional through-hole assemblies, but for minimal additional cost can also be supplied as a dual-wave system for surface mount and mixed technology boards. Dual-wave technology often provides improved hole penetration and reduced bridging on difficult-to-solder boards of all technologies and therefore makes the dual-wave configuration very popular. If necessary, the chip wave in dual-wave systems can easily be deactivated through the installation of a nozzle cover plate included with this option. Wave height control is dial-adjustable to a maximum height setting of 10 mm (.39") and the wave pump motor, with on/off control activated by optical board sensors on the conveyor, is also protected by low temperature and overheat alarms.

Adjustable Fiber-Finger Conveyor and IR Preheater Allow Precise Lead-Free Profiling

The C250 Wave Soldering System includes a high-temperature, corrosion-resistant, fiber-finger conveyor system with variable speed up to 2 m/min (79"/min). Conveyor angle (3°-6°) and width are easily-adjustable to accommodate PCBs from 30 mm to 250 mm (1.2" to 10"). A chain-driven, pin-type inlet conveyor is included as standard and allows easy loading of assemblies and smooth transfer into the conveyor fingers.
After flux application, a 420 mm IR preheater uses stainless-steel sheath-type heaters to raise PCBs and components to manufacturers' recommended temperatures for proper activation of VOC-Free and Lead-Free fluxes.

Innovative Drum-Spray Fluxing System Provides Benefits of Both Spray and Foam Methods

A reliable, easy-to-use foam fluxing system is included with the standard C250 and provides extremely consistent, maintenance-free performance over extended periods. For assemblers looking for even greater precision, the C250 can also be purchased with our optional "drum-spray" fluxing system. Drum-Spray Fluxing Technology is designed to deliver the precision of spray fluxing through a simple, innovative design that is easier to set up and maintain, and less costly to operate than other spraying methods. As shown in the diagram below, the Drum-Spray nozzle is positioned as close to the bottom of the PCB as possible and precisely applies flux in a thin vertical knife pattern across the full width of the board as it passes over the rotating drum. This method has been shown to provide more uniform application and less flux waste than systems that utilize small nozzles mounted to a reciprocating motor drive below the PCB. An adjustable mask is used to control the width of the spray pattern and optical sensors provide on/off control of the spray mechanism.