C350 Lead Free Soldering Machine


Product Features & Benefits

  • Best in Class Lead Free
  • Compact & economy designed for PCB width Max. 350mm
  • Solder tank contains 158kg only

 

Features


C350 Wave Solder Key Features

  • High-Quality Design and Construction To Meet Standards of Japanese Electronics Market
  • Small Footprint - Approx. 2340 mm x 980 mm (92.1" x 38.5")
  • Single- or Dual-Wave Configurations for Through-Hole and Surface Mount Assemblies
  • Seamless, Cast-Iron (150 kg cap.) Solder Pot with Corrosion-Resistant Coating and Three-Year Warranty
  • Built-In Solder Pot Loading and Maintenance Platform with Locking Support Mechanism
  • Heavy-Duty Pump Motor with Dial-Adjustable Wave Height Control; Low-Temp and Overheat Alarms
  • Innovative Drum-Spray Fluxer for Superior Flux Application Consistency and Reduced Operating Cost
  • Optical Sensors for On/Off Control of Fluxing and Wave Operations
  • Stainless-Steel Sheath-Type IR Preheater with PID Temperature Control Control
  • High-Temperature, Corrosion-Resistant, Finger-Type Conveyor with Width and Angular Adjustment
  • Inlet Pin-Type Conveyor Standard. Optional Motorized, Chain-Driven, Pin-Type Inlet Conveyor Available
  • Air Knife Option Distributes Flux Evenly While Preventing Flux from Entering Preheat Area
  • Touch-Panel PLC Controller with Weekly Timer for Startup and Shutdown

 

More Information


Specially Coated 150 kg Solder Pot Includes Three Year Replacement Warranty

The C350 includes a seamless, cast-iron solder pot with a specially formulated, corrosion resistant coating and is covered by a full three-year replacement warranty. In keeping with the C350's compact design, the solder pot, despite its ample 350 mm width, has a modest 150 kg capacity, reducing overall startup costs and contributing to its low cost of ownership. High-efficiency heaters, combined with the pot's small volume, considerably reduce startup time and consume much less energy, but more importantly reduce oxidation and dross formation. Another unique feature of the C350 system (like the C250) is that the solder pot and wave assembly easily slide out from the rear of the unit onto an extendable platform for easy loading and maintenance.

Single- or Dual-Wave Configurations to Suit Any Wave Soldering Application

The C350 is supplied as standard in a single-wave configuration for conventional through-hole assemblies, but for minimal additional cost can also be supplied as a dual-wave system for surface mount and mixed technology boards. Dual-wave technology often provides improved hole penetration and reduced bridging on difficult-to-solder boards of all technologies and therefore makes the dual-wave configuration very popular. If necessary, the chip wave in dual-wave systems can easily be deactivated through the installation of a nozzle cover plate included with this option. Wave height control is dial-adjustable to a maximum height setting of 10 mm (.39") and the wave pump motor, with on/off control activated by optical board sensors on the conveyor, is also protected by low temperature and overheat alarms.

Adjustable Fiber-Finger Conveyor and IR Preheater Allow Precise Lead-Free Profiling

The C350 Wave Soldering System includes a high-temperature, corrosion-resistant, fiber-finger conveyor system with variable speed up to 2 m/min (79"/min). Conveyor angle (3°-6°) and width are easily-adjustable to accommodate PCBs from 30 mm to 350 mm (1.2" to 10"). A chain-driven, pin-type inlet conveyor is included as standard and allows easy loading of assemblies and smooth transfer into the conveyor fingers. After flux application, a 600 mm IR preheater uses stainless-steel sheath-type heaters to raise PCBs and components to manufacturers' recommended temperatures for proper activation of VOC-Free and Lead-Free fluxes. The IR preheat zone is enclosed in a stainless steel internal housing, with a temperature resistant, dual-layer, glass hood, for increased thermal stability.

Innovative Drum-Spray Fluxing System Included As Standard Equipment

Our revolutionary Drum-Spray Fluxing Technology, included as standard equipment with C350 systems, combines the simplicity of a foam fluxer with the precision of a spray fluxing system. Its simple, innovative design is extremely easy to set up and maintain and is just one more example of a feature we've added to contribute to the C350's low cost of ownership. As shown in the diagram below, the Drum-Spray nozzle is positioned as close to the bottom of the PCB as possible and precisely applies flux in a thin vertical knife pattern across the full width of the board as it passes over the rotating drum. This method has been shown to provide more uniform application and less flux waste than systems that utilize small nozzles mounted to a reciprocating motor drive below the PCB. An adjustable mask is used to control the width of the spray pattern and optical sensors provide on/off control of the spray mechanism.

 

Video & Photo

 

Corrosion-Resistant, Low-Volume, Seamless Solder Pot
The C350 includes a specially-coated, seamless, cast-iron solder pot that includes a three-year replacement warranty. Supplied as standard in a single-wave configuration, the C350 is also available as a dual-wave system to accommodate both conventional and surface mount assemblies. While the C350 can accommodate full-size PCBs with its generous 350 mm wave width, the C350 solder pot has a relatively modest 150 kg capacity, resulting in a low start-up cost.
Solder Pot Handling System Allows Easy Loading and Maintenance
When the solder pot access panel on the rear of the unit is opened, the support legs (shown folded for storage at left) drop down and lock in place. The high-temperature, seamless solder pot and pump assembly can then slide out onto the access panel which now serves as a handy platform for easy loading and maintenance.
Innovative Drum-Spray Fluxing System is Easy to Use and Maintain

C350 systems include our unique drum-spray fluxer as standard equipment. Drum-Spray Fluxing Technology applies flux in a thin vertical knife pattern across the full width of the board as it passes over the rotating drum. This method has been shown to provide more uniform application and less flux waste than other spray methods and is also easier, and less costly, to operate and maintain. 

Corrosion-Resistant, Fiber Finger Conveyor and Pin-Type Input Mechanism

The C350 fiber-finger conveyor easily adjusts to accommodate boards from 30 mm to 350 mm (1.2" to 13.75") and will not be degraded by the high temperatures or corrosivity of lead-free solders. The chain-driven, pin-type inlet conveyor (included as standard) adjusts in unison with the finger conveyor and allows for easy loading of assemblies and smooth transfer into the fiber fingers.

Stainless-Steel Sheath-Type IR Preheater for Flux Activation

After flux application, the C350's 600 mm standard PID-controlled IR preheater uses stainless-steel sheath-type heaters to raise PCBs and components to manufacturers' recommended temperatures for proper activation of VOC-Free and Lead-Free fluxes. 

Enclosed Preheat Chamber for Increased Temperature Stability

The C350 preheater is enclosed in a stainless steel inner housing with a hinged, temperature resistant, dual-layer, glass hood, for increased thermal stability.

High-Quality Construction Designed for Low Cost of Ownership and Easy Maintenance

The C Series Lead-Free Wave Soldering Systems are designed to meet the reliability standards of the Japanese electronics market and are built to the highest standards of quality at our factory in Taiwan. As shown in this photo, all of the C350's major system components are easily accessible for cleaning and maintenance through a single hinged upper panel. Dial-adjustable wave height and conveyor speed controls are located below the intuitive, LCD touch-panel user interface.

 

Specification

C350 Wave Solder Specification
 

Specifications Model C350
Maximum Board Width: 350 mm (13.75")
Minimum Board Width: 30 mm (1.2")
Maximum Wave Height: 10 mm (0.4")
Preheat Length: 600 mm (23.8")
Conveyor Speed: 0 - 2.0 m/min (0" - 79"/min)
Conveyor Angle: 3° to 6° (adjustable)
Solder Capacity: 150 Kg (330 lbs.)
Solder Temperature: Ambient - 300°C (Ambient - 572°F)
Machine Dimensions: 2340 mm (92.12") L 
980 mm (38.5") W
1420 mm (56") H
Not including warning light.
Net Weight: Approx. 600 Kg (1320 lbs.)
Air Pressure Requirements: 5 Kg/cm² (70 psi)
Air Volume Requirements: 25 CFM
Total Power Consumption: 220 V, 3-Phase, 50/60 Hz 
13.2 KW

 

Main construction


STANDARD

Inlet rail, Foam Fluxer, Pre-heater, Single wave solder pot, Jig for anti-oxidization, Solder pot roll in/out devices, Panel meter control system, Finger conveyor.

Inlet Rail Foam fluxer & Pre-heater Single wave solder pot Solder pot Roll in/out device

 

OPTION

Inlet rail, Foam Fluxer, Pre-heater, Single wave solder pot, Jig for anti-oxidization, Solder pot roll in/out devices, Panel meter control system, Finger conveyor.

Inlet Rail Foam fluxer & Pre-heater Single wave solder pot Solder pot Roll in/ out device Nitrogen supply needle valve

 

Support

Support

Support Information & File Downloads